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  • Flash Type: 3D TLC NAND flash
  • Type: M.2 22110
  • Interface: PCIe NVMe Gen 3x4
  • Seq. Read: Up to 1,700 MB/s
  • Seq. Write: UP to 670 MB/s
  • Features: AES/PLP
  • Capacity: 960GB
  • High I/O and throughput performance
  • Performance consistency
  • Command low latency
  • Power Loss Protection
  • Temperature Sensor
  • Customized Firmware
  • Thermal Throttling
  • Power Loss Data Protection
  • End to End Data Path Protection

    Model EP3
    Capacity 960GB
    Flash Type 3D TLC NAND flash
    Performance EP3
    Seq. Read (MB/s) Up to 1,700
    Seq. Write (MB/s) Up to 670
    Environment and Reliability
    Power Requirement DC 3.3V 2.5A (Max)
    Temperature  0-70 degrees(operating)
    MTBF 1,500,000 hours
    Agency Approval FCC, CE, VCCI, BSMI, KCC, RCM, TUV, UL, CB
    Command Set Support M.2 PCIE Gen 3x4 NVMe
    Interface PCIe NVMeGen 3x4
    Form Factor and Connectors
    Form Factor M.2 22110
    Power Connector M.2 connector  for DC 3.3V
    Data Connector M.2 connector
    Dimension and Weight
    Dimension (L/W/H) 110.00 mm x 22.00 mm x 5.00 mm
    Weight (Max.) 16g
    Feature AES/PLP